Methods of Making Flash Memory Cell Arrays Having Dual Control Gates Per Memory Cell Charge Storage Element

ABSTRACT

Methods of fabricating a dual control gate non-volatile memory array are described. Parallel strips of floating gate material are formed over the substrate in a first direction but separated from it by a tunnel dielectric. In the gaps between these strips control gate material is formed forming a second set of parallel strips but insulated from both the adjacent floating gate stripes and the substrate. Both sets of strips are isolated in a second direction perpendicular to the first direction forming an array of individual floating gates and control gates. The control gates formed from an individual control gate strip are then interconnected by a conductive wordline such the potential on individual floating gates are controlled by the voltages on two adjacent wordlines. In other variations either the floating gates or the control gates may be recessed into the original substrate.

CROSS-REFERENCE TO RELATED PATENT

This extends the technology of U.S. patent application Ser. No. 10/282,747, filed Oct. 28, 2002, published Apr. 29, 2004, under no. 2004/0079988 A1, now U.S. Pat. No. 6,888,755, naming Eliyahou Harari as inventor.

BACKGROUND OF THE INVENTION

This invention relates generally to non-volatile semiconductor memories of the flash EEPROM (Electrically Erasable and Programmable Read Only Memory) type, their formation, structure and use, and specifically to methods of making NAND memory cell arrays.

There are many commercially successful non-volatile memory products being used today, particularly in the form of small form factor cards, which use an array of flash EEPROM cells.

One popular flash EEPROM architecture utilizes a NAND array, wherein a large number of strings of memory cells are connected through one or more select transistors between individual bit lines and a reference potential. A portion of such an array is shown in plan view in FIG. 2A. BL0-BL4 represent diffused bit line connections to global vertical metal bit lines (not shown). Although four floating gate memory cells are shown in each string, the individual strings typically include 16, 32 or more memory cell charge storage elements, such as floating gates, in a column. Control gate (word) lines labeled WL0-WL3 and string selection lines DSL and SSL extend across multiple strings over rows of floating gates, often in polysilicon (labeled P2 in FIG. 2B, a cross-section along line A-A of FIG. 2A). The control gate lines are typically formed over the floating gates as a self-aligned stack, and are capacitively coupled with each other through an intermediate dielectric layer 19, as shown in FIG. 2B. The top and bottom of the string connect to the bit line and a common source line respectively, commonly through a transistor using the floating gate material (P1) as its active gate electrically driven from the periphery. This capacitive coupling between the floating gate and the control gate allows the voltage of the floating gate to be raised by increasing the voltage on the control gate coupled thereto. An individual cell within a column is read and verified during programming by causing the remaining cells in the string to be turned on hard by placing a relatively high voltage on their respective word lines and by placing a relatively lower voltage on the one selected word line so that the current flowing through each string is primarily dependent only upon the level of charge stored in the addressed cell below the selected word line. That current typically is sensed for a large number of strings in parallel, thereby to read charge level states along a row of floating gates in parallel. Examples of NAND memory cell array architectures and their operation as part of a memory system are found in U.S. Pat. Nos. 5,570,315, 5,774,397 and 6,046,935.

The charge storage elements of current flash EEPROM arrays are most commonly electrically conductive floating gates, typically formed from doped polysilicon material. Another type of memory cell useful in flash EEPROM systems utilizes a non-conductive dielectric material in place of a conductive floating gate to store charge in a non-volatile manner. Such a cell is described in an article by Chan et al., “A True Single-Transistor Oxide-Nitride-Oxide EEPROM Device,” IEEE Electron Device Letters, Vol. EDL-8, No. 3, March 1987, pp. 93-95. A triple layer dielectric formed of silicon oxide, silicon nitride and silicon oxide (“ONO”) is sandwiched between a conductive control gate and a surface of a semi-conductive substrate above the memory cell channel. The cell is programmed by injecting electrons from the cell channel into the nitride, where they are trapped and stored in a limited region. This stored charge then changes the threshold voltage of a portion of the channel of the cell in a manner that is detectable. The cell is erased by injecting hot holes into the nitride. See also Nozaki et al., “A 1-Mb EEPROM with MONOS Memory Cell for Semiconductor Disk Application,” IEEE Journal of Solid-State Circuits, Vol. 26, No. 4, April 1991, pp. 497-501, which describes a similar cell in a split-gate configuration where a doped polysilicon gate extends over a portion of the memory cell channel to form a separate select transistor.

Memory cells of a typical non-volatile flash array are divided into discrete blocks of cells that are erased together. That is, the block contains the minimum number of cells that are separately erasable together as an erase unit, although more than one block may be erased in a single erasing operation. Each block typically stores one or more pages of data, a page defined as the minimum number of cells that are simultaneously subjected to a data programming and read operation as the basic unit of programming and reading, although more than one page may be programmed or read in a single operation. Each page typically stores one or more sectors of data, the size of the sector being defined by the host system. An example is a sector of 512 bytes of user data, following a standard established with magnetic disk drives, plus some number of bytes of overhead information about the user data and/or the block in which it is stored.

As in most all integrated circuit applications, the pressure to shrink the silicon substrate area required to implement some integrated circuit function also exists with flash EEPROM arrays. It is continually desired to increase the amount of digital data that can be stored in a given area of a silicon substrate, in order to increase the storage capacity of a given size memory card and other types of packages, or to both increase capacity and decrease size. Another way to increase the storage density of data is to store more than one bit of data per memory cell charge storage element. This is accomplished by dividing a window of a storage element charge level voltage range into more than two states. The use of four such states allows each cell to store two bits of data, eight states stores three bits of data per cell, and so on. A multiple state flash EEPROM structure and operation is described in U.S. Pat. Nos. 5,043,940 and 5,172,338.

SUMMARY OF THE INVENTION

A significant limitation on the continued shrinking of the size of current non-volatile memory cell arrays is the floating gate dielectric. This cannot practically be made thinner than the approximately 70 Angstrom (7 nm) minimum thickness currently being used without resulting in leakage and difficulties in long term data retention. This means that the voltages required to be coupled to the floating gates to control conduction in the memory cell channels below them cannot be reduced as the size of the various gates and distances between them are reduced. Undesired coupling of voltages between the various gates increases as the distance between them decreases unless a compensating reduction in the voltage levels being used can be made. It is important that such a reduction be made if future scaling of memory arrays is to be made.

A reduction in the level of the control gate voltages is made possible if the coupling ratio of the floating gate can be increased. The coupling ratio is equal to the capacitance between the floating and control gates, divided by the capacitance between the floating gate and all adjacent electrodes, most specifically the substrate, as is well known. The values of these capacitances depend upon the size of the opposing surface areas that are coupled, and the thickness and dielectric constants of the dielectric layers between them. Reduction of the coupling ratio is difficult to achieve in NAND arrays because of their stacked control and floating gate structures. When the coupling area of the floating gate with the substrate is made smaller as part of a shrink, which as a denominator could result in an increase in the coupling ratio, the coupling area between the floating gate and the control gate is similarly reduced, which causes the numerator to decrease as well.

Another undesired effect of scaling is an increase in parasitic capacitances between conductive array elements, particularly between adjacent floating gates. Errors in programming or in reading the state of one floating gate can, for example, be caused by the close proximity of the charge stored on the floating gate of an adjacent cell. This coupling can create a significant number of errors in multi-state operation where the allowed range of threshold voltages of the floating gate transistor that is devoted to each state is very small.

According to a primary aspect of the present invention, methods of forming a dual control gate non-volatile memory structure are provided. In one embodiment, a first plurality of horizontal strips of conductive material are formed in one direction across the surface of a substrate but separated from it by a tunneling dielectric and separated from each other by gaps in a second direction essentially perpendicular to the first direction, forming a first set of conductive strips. The gaps between these strips are subsequently filled with conductive material insulated from both of the adjacent first conductive strips and the underlying substrate, thus forming a plurality of second conductive strips parallel to the first set of strips. A plurality of a third set of parallel strips running in the second direction are then formed and the conductive material of both the first and second set of strips along with the separating insulator are removed in the gaps between the third set of strips. Additionally the substrate is partially etched in this region forming a shallow trench and this trench is filled with an insulator, thereby forming a two dimensional array of conductive elements. Elements from the first set of strips form the floating gates of a non-volatile memory device and a pair of adjacent elements from the second set of strips form the control gates which can be electrically coupled to the adjacent floating gates to control their potential. A fourth set of conductive strips is formed in the first direction with gaps in the second direction such that each individual strip is in ohmic contact with a plurality of control gates formed from a common second strip, thus forming wordlines capable of controlling the potential on each of the underlying control gates. An individual floating gate can store a charge state that can be programmed and read out by varying the potential on the adjacent control gates. This charge state can be a multi-level state representing one or more binary bits of information.

In another embodiment the region of the substrate under the control gates can be doped to provide conductivity between adjacent memory cells even the absence of the control gate voltage. In yet another embodiment adjacent floating gates in the first direction may be offset with respect to each other.

In yet another embodiment the first set of strips may be formed using spacer technology and their widths and spacings may be less than that directly attainable from the exposure capability of the equipment available to image such patterns.

In other embodiments either the first set of strips or the second set of strips may be recessed at least partially into the silicon surface.

Additional aspects, advantages and features of the present invention are included in the following description of exemplary examples thereof, which description should be taken in conjunction with the accompanying drawings. All patents, patent applications, articles, technical papers and other publications referenced herein are hereby incorporated herein in their entirety by this reference.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a block diagram of a type of memory system in which the memory cell array and operational improvements of the present invention may be implemented;

FIG. 2A is a plan view of a prior art NAND array;

FIG. 2B is a cross-sectional view of the prior art NAND array of FIG. 2A taken along the line A-A;

FIG. 3 is a plan view of an example memory cell array in a NAND configuration;

FIG. 4 is a cross-sectional view of the array of FIG. 3, taken at section A-A thereof;

FIG. 5A is a cross-sectional view of the array of FIG. 3, taken at section B-B thereof;

FIG. 5B is a cross-sectional view of the array of FIG. 3, taken at section C-C thereof,

FIG. 6 is a cross-sectional view of a modified version of the array of FIGS. 3-5, taken at section B-B, at a corresponding process stage to FIG. 5A of the first embodiment.

FIGS. 7-10 are cross-section views of sequentially formed structures of a second embodiment of the array of FIGS. 3-5, taken at section A-A of FIG. 3;

FIG. 11 is an enlarged cross-sectional view of a memory cell of either of the embodiments of FIGS. 3-5 or 7-10, to illustrate an advantage thereof;

FIG. 12 is a cross-sectional view of an alternate memory cell construction that may be implemented in either of the embodiments of FIGS. 3-5 or 7-10;

FIG. 13 illustrates the capacitive coupling between gate elements and the substrate of either of the embodiments of FIGS. 3-5 or 7-10;

FIG. 14 is an equivalent circuit diagram of a memory cell array according to either of the embodiments of FIGS. 3-5 or 7-10;

FIG. 15 is a table of example memory cell array operating conditions that reference the circuit diagram of FIG. 14;

FIG. 16 is a circuit diagram of one NAND string used for illustration of methods of reading the NAND memory;

FIGS. 17A-17N and 17P show sequential processing steps according to an alternate embodiment that form a memory array;

FIGS. 18A-18D illustrates use of the process of FIGS. 17A-17N and 17P to form a memory array with a different topography;

FIGS. 19A-19B show another embodiment that is a variation of the embodiment of FIGS. 17A-17N and 17P;

FIGS. 20A-20C show yet another embodiment that is a variation of the embodiments of FIGS. 17A-17N, 17P and 19A-19B; and

FIG. 21 is a flowchart summarizing the processes of FIGS. 17A-20C.

DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS

Memory System

An example memory system in which the various aspects of the present invention may be implemented is illustrated by the block diagram of FIG. 1. A memory cell array 1 including a plurality of memory cells M arranged in a matrix is controlled by a column control circuit 2, a row control circuit 3, a c-source control circuit 4 and a c-p-well control circuit 5. The memory cell array 1 is, in this example, of the NAND type that is described above in the Background and in references incorporated therein by reference. A control circuit 2 is connected to bit lines (BL) of the memory cell array 1 for reading data stored in the memory cells (M), for determining a state of the memory cells (M) during a program operation, and for controlling potential levels of the bit lines (BL) to promote the programming or to inhibit the programming. The row control circuit 3 is connected to word lines (WL) to select one of the word lines (WL), to apply read voltages, to apply program voltages combined with the bit line potential levels controlled by the column control circuit 2, and to apply an erase voltage coupled with a voltage of a p-type region on which the memory cells (M) are formed. The c-source control circuit 4 controls a common source line (labeled as “c-source” in FIG. 1) connected to the memory cells (M). The c-p-well control circuit 5 controls the c-p-well voltage.

The data stored in the memory cells (M) are read out by the column control circuit 2 and are output to external I/O lines via an I/O line and a data input/output buffer 6. Program data to be stored in the memory cells are input to the data input/output buffer 6 via the external I/O lines, and transferred to the column control circuit 2. The external I/O lines are connected to a controller 9. The controller 9 includes various types of registers and other memory including a volatile random-access-memory (RAM) 10.

Command data for controlling the flash memory device are inputted to command circuits 7 connected to external control lines that are connected with the controller 9. The command data informs the flash memory of what operation is requested. The input command is transferred to a state machine 8 that controls the column control circuit 2, the row control circuit 3, the c-source control circuit 4, the c-p-well control circuit 5 and the data input/output buffer 6. The state machine 8 can output a status data of the flash memory such as READY/BUSY or PASS/FAIL.

The controller 9 is connected or connectable with a host system such as a personal computer, a digital camera, or a personal digital assistant. It is the host that initiates commands, such as to store or read data to or from the memory array 1, and provides or receives such data, respectively. The controller converts such commands into command signals that can be interpreted and executed by the command circuits 7. The controller also typically contains buffer memory for the user data being written to or read from the memory array. A typical memory system includes one integrated circuit chip 11 that includes the controller 9, and one or more integrated circuit chips 12 that each contain a memory array and associated control, input/output and state machine circuits. The trend, of course, is to integrate the memory array and controller circuits of a system together on one or more integrated circuit chips.

The memory system of FIG. 1 may be embedded as part of the host system, or may be included in a memory card that is removably insertible into a mating socket of a host system. Such a card may include the entire memory system, or the controller and memory array, with associated peripheral circuits, may be provided in separate cards. Several card implementations are described, for example, in U.S. Pat. No. 5,887,145.

First NAND Array Embodiment

Major components of a few memory cells of a NAND array are illustrated in plan view in FIG. 3, with an equivalent circuit thereof shown in FIG. 14 where corresponding elements are indicated by the same reference number as in FIG. 3 but with a prime (′) added. Five strings 21-25 of series connected memory cells are included, with three floating gate charge storage elements shown in each string. The string 21 includes floating gates 27, 28 and 29, the string 22 has floating gates 30, 31 and 32, the string 23 includes floating gates 33, 34 and 35, the string 24 has floating gates 36, 37 and 38, and the string 25 includes floating gates 39, 40 and 41. Only a small rectangular array of fifteen memory cells is illustrated for ease of explanation. Actual implementations of such an array include millions of such memory cells in thousands of NAND strings, each string normally having 16, 32 or more memory cells. It is understood that the memory array is typically positioned over one or more well regions contained within a common substrate in order to allow the local substrate potential of the memory array to be electrically controlled independent of the common substrate potential. The use of the term “substrate” with respect to a memory array of transistors throughout this description will include reference to such well regions unless specifically noted.

Each of the NAND strings 21-25 includes two select transistors, one at each end of the string, to controllably connect the string between a different one of global bit lines BL0-BL4 (FIG. 14) and a reference potential V_(S). V_(S) is normally ground during read but may assume a small positive value during programming to assist in minimizing leakage across the source select transistor. Voltage V_(SSL) is applied to respective gates 43-47 of select transistors T_(0S)-T_(4S) control connection of one end of their respective memory cell strings 21-25 to V_(S). The other ends of the strings 21-25 are connected through respective select transistors T_(0D)-T_(4D) (FIG. 14) to the respective bit lines BL0-BL4 by voltage V_(DSL) applied to select transistor gates 49-53. The column control circuits 2 (FIG. 1) apply a voltage to each bit line that is representative of the specific data to be written, or sense the voltage or current during a read operation. The select transistors T_(0S)-T_(4S) and T_(0D)-T_(4D) (FIG. 14) include respective source and drain regions 55-64 and 65-74 (FIG. 3) in a semiconductor substrate 77 at its surface 79 (FIGS. 4, 5A and 5B).

A typical prior art NAND array includes control gate (word) lines extending across multiple strings over rows of floating gates with a suitable insulating dielectric layer therebetween. Close coupling between the control and floating gates is desirable, as discussed above, in order to minimize the control gate voltages that are required to raise the coupled floating gates to the voltage levels necessary for programming and reading their states. One control gate (word) line is used for each row of floating gates. In order to make an array with the floating and control gates self-aligned in a y-direction (along the lengths of the NAND strings), the control gates are typically used as masks to form the floating gates, which then have the same dimensions in the y-direction as the control gates. There are limited opportunities with this architecture to increase the area of coupling between the control and floating gates in order to increase the coupling ratio discussed above in order to enable operation with lower control gate voltages appropriate to future scaled technologies.

Therefore, in the NAND array shown in FIGS. 3-5, control gate (word) lines 81-84 are positioned between the floating gates instead of on top of them. Each of the control gate lines extends across multiple strings of memory cells and is capacitively coupled through a suitable insulating dielectric, such as multi-layer oxide-nitride-oxide (ONO), to the floating gates on both sides. Additional coupling area is obtained by using the sidewall areas of both sides of the floating gates. The floating gates can be made thicker (higher) than usual in order to increase this coupling area, and the control gates in between them are then made to be at least as thick as the floating gates in order to take advantage of the added coupling area. An advantage is that this coupling area may be controlled largely independently of the coupling area of the floating gates and the substrate, resulting in a desirably high coupling ratio even as the coupling area of the floating gates with the substrate is reduced during future shrinks.

Two of these control gate lines replace a single word line of conventional prior art NAND arrays. For example, the word line that would extend across the row of floating gates 27, 30, 33, 36 and 39 in a conventional array is replaced by two control gate lines 81 and 82 (WL0 and WL1). Similarly, a word line that would normally extend across the row of floating gates 28, 31, 34, 37 and 40 is replaced by two control gate lines 82 and 83 (WL1 and WL2). The control lines 81-84 are elongated in the x-direction across the array and separated in the y-direction by the length of the intervening floating gates and the thicknesses of the dielectric layers between them. Although the size of the memory floating gate is typically made as small as the photolithography allows in both x and y dimensions, the channel length of the select transistors 43-47 and 49-53 (y-dimension) is typically slightly larger than the minimum feature size to ensure it can effectively block all conduction including leakage when the maximum voltage is applied across it.

A method of forming the array of FIG. 3, and additional features of the array, can be explained by reference primarily to the orthogonal cross-section views of FIG. 4 (line A-A in the y-direction of FIG. 3 through one string of memory cells), FIG. 5A (line B-B in the x-direction of FIG. 3 along a row of memory cells extending across multiple strings), and FIG. 5B (line C-C in the x-direction of FIG. 3 along a word line). After doping of the substrate 77, typically including formation of one or more wells, a layer 91 of tunnel silicon oxide (SiO₂) is grown on the surface 79 of the substrate 77 to a thickness of about 8 nm. A first layer of doped polysilicon is then formed over at least the area of the array, typically by low-pressure chemical vapor deposition (LPCVD), to a thickness of from 50 to 200 nm. from which the floating gates are later formed. This is thicker than the usual first polysilicon layer in prior art NAND devices, with the result that the later formed floating gates are thicker than previously. A thin pad 93 of silicon dioxide is then formed over the top of the polysilicon layer, followed by depositing a layer 95 of silicon nitride (Si₃N₄) of thickness typically between 100 and 300 nm. A mask is then formed on the top of the nitride layer for etching the exposed Nitride, oxide pad, polysilicon and tunnel oxide to leave stacked strips elongated across the substrate in the y-direction and separated in the x-direction by the smallest spacing dimension resolvable by the mask formation process. The width of these strips is also preferably made equal to their spacing. The etch is anisotropic and exposes the surface 79 of the substrate 77 between these strips.

A next series of steps provides electrical isolation between resulting columns of floating gates by Shallow Trench Isolation (STI). The exposed substrate surface is then anisotropically etched to form trenches 97-100 (FIG. 5A) elongated in the y-direction and positioned between the polysilicon/dielectric stack strips in the x-direction. These trenches are preferably etched to a depth of 100-300 nm. The exposed silicon surface region may be implanted with a light Boron dose to locally increase the field oxide threshold voltage if needed. A thick oxide layer is then deposited over the entire array area to completely fill these trenches and the spaces between the polysilicon/dielectric stacked strips. Excess oxide above the stacked strips is then removed by Chemical Mechanical Polishing (CMP), down to the nitride layer 95 used as a stop. A relatively flat surface then exists across the tops of the nitride strips 95 and thick oxide (regions 97-100 in FIG. 5A). As is well known in the art, high temperature annealing may be employed to relieve the mechanical stress in the silicon isolation trenches as well as to densify the thick oxide in these trenches. It is also possible to form the array without employing shallow trench isolation, for example by forming thick dielectric isolation above the silicon surface rather than in trenches etched into it.

In a next step, a mask is formed with strips extending in the x-direction, perpendicular to the polysilicon/dielectric strips just formed, between which the polysilicon/dielectric strips are removed down to the tunnel dielectric layer 91 by an anisotropic etch. The sum of the width of the strips of the mask and the spaces between them are made to be as small as possible, the pitch of the process. The actual mask may be photoresist over another deposited layer of nitride or oxide that is masked and etched to form the masking strips in the x-direction, followed by etching the thus exposed underlying first polysilicon layer and a portion of the exposed field oxide regions. This separates the remaining strips of the first polysilicon layer into the individual floating gates. The etch process first removes approximately 100-200 nm of exposed field oxide and then the chemistry is changed to selectively remove the entire exposed first polysilicon layer while stopping on the underlying tunnel oxide. In addition to forming the floating gates, the first polysilicon layer can also be used to form the select transistor gates 45 and 51 as shown.

After this etch, trenches are formed alongside the first polysilicon strips with lengths in the x-direction. Over the active regions these trenches will extend the full height of the floating gate plus the thickness of masking layers 93 and 95, and over the field regions they will extend 100-200 nm as was formed during the first polysilicon separation step described previously. It is in these trenches that the control gate lines 81-84, select gates lines 80 and 85, and source and bit line contacts are formed. But before forming these control gate lines, ions are implanted in the trenches in regions noted on areas of the plan view of FIG. 3 that are lightly dotted. The cross-sectional view of FIG. 4 shows such memory transistor and select gate implanted source and drain regions 67, 72, 105, 106, 62 and 57. N+ ions may typically be implanted with a dose within a range of 5E13-1E15. A dielectric layer 103 is then formed over the exposed surfaces of the structure, including conforming to the sidewalls and bottom surfaces of the newly formed trenches. The layer 103 is preferably ONO but may also be a material having a higher dielectric constant.

A second layer of doped polysilicon is then deposited over the array area, including completely filling the trenches and contacting the dielectric layer 103. This polysilicon is then removed from the top of the structure by CMP, down to the nitride layer 95 (or alternately to the portion of ONO layer 103 immediately in contact with layer 95) that is used as a stop, followed by a controlled etch of the polysilicon a small distance into the trenches. This polysilicon is also removed using a masking step from those regions of the periphery and array in which contacts to source & drain regions are desired. The control gate lines 81-84, the SSL line 80, and the DSL line 85 are the result. These lines are made to extend at least as high as the floating gates to which they are capacitively coupled through the dielectric layer 103.

Since these narrow control gate lines are typically driven from one end and extend over a significant portion of the memory array, their series resistance is of concern. Consequently the doped polysilicon may be replaced or supplemented with a variety of materials to address this concern. The tops of the control gate lines may be silicided and a thicker layer than normal may be used in this application since they are defined by CMP rather than chemical etching. Alternatively, another conductive material, such as tungsten or molybdenum, may be used instead of the doped second polysilicon. In yet another embodiment the control gates can be formed as a hybrid of polysilicon capped by low resistivity metallic interconnect. This can be accomplished for example when the top exposed surfaces of the second polysilicon control gate lines 81-84 are partially etched down, then is coated with a thin sputtered layer of a barrier metal followed by the deposition of a metallic layer such as tungsten or molybdenum. This composite layer is then etched back employing CMP using the nitride masking layer as etch stop. The resulting interconnect structure provides strips of narrow low resistivity metallic word lines running in the x-direction, being in electrical contact with the underlying second polysilicon in the trenches, and isolated from adjacent similar word lines by the masking dielectric layer 95 laying on top of the floating gates. FIG. 5B shows a cross section through section C-C of FIG. 3 at this stage of the process.

Next, all periphery circuits and transistors are formed, the array of NAND strings is covered with a dielectric insulation layer (not shown), and one or more layers of standard via/metalization (aluminum or copper interconnects) follows to provide electrical access to all bit lines, source lines, word lines and access transistors. These metalization layers can be used as local or global interconnects to reduce the resistivity of long word lines that may become exceedingly narrow and therefore quite highly resistive across large memory arrays.

There are several methods of interconnecting the select gates and implementing the source and drain contacts. One such method is illustrated in FIGS. 3-5 in which the SSL 80 and DSL 85 lines are formed from P2 (the same material as the word lines). The select gate transistors use P1 as their gate material, which should be directly contacted and not left floating. One way to accomplish this is with a direct contact between the horizontal P2 line and each P1 gate. After a first P2 thickness is deposited, a mask is used to selectively remove the ONO layer 103 only on the side of the SSL select gate nearest the common source line contact and on the side of the DSL select gate nearest the bit line contact. Then a second P2 layer is deposited such that the combined thickness of P2 after CMP polishing and etch-back as described earlier is as shown in FIG. 4. This second P2 deposition makes ohmic contact with both the first P2 deposition and the P1 gate material and allows the P2 SSL and DSL lines to directly contact the P1 gates of the respective select transistors. Contacts to the source select transistor's source region which is common to many NAND strings can be made using a horizontal metal line (M0 79 in FIG. 3), and contacts to the drain select transistor's drain region are made to a vertical metal line (not shown), one metal line for each column of NAND strings. These connections are typically made at the same time as the interconnections in the periphery region. An alternate method (not shown) of making contact to the select gates is to use a mask to open contact regions on top of each gate and interconnect these regions with a horizontal poly or metal line located directly above the select transistors gates, again typically during formation of the periphery circuits and interconnections.

Because the control gates are formed along side the floating gates, the structure of FIGS. 3-5 has a more planar topography than the usual NAND array. A primary advantage of this structure is the increased coupling area between the floating gates and the control gates, which leads to an improved capacitive coupling ratio, which in turn allows lower control gate voltages to be used during operation of the memory cell array. Additionally, positioning of the control gate lines between the floating gates in the strings shields these floating gates from each other, thereby significantly reducing, or even eliminating, the undesirable coupling between adjacent floating gates in the column direction. Also, as best shown in FIG. 4, the control gate lines 81-84 can be capacitively coupled through the dielectric layers 91 and 103 with the ion implanted source and drain regions in the substrate 77, and thus employed to raise (boost) the voltage of the substrate surface 79 in these regions. The level of the ion implantation can be made less than usual if the control gate lines are used to control the level of conduction through the implanted regions under them, which this structure allows.

Additionally, and perhaps most importantly, advantage may be taken of future reductions of the process pitch to reduce the sizes of floating gates and other elements, and the spaces between them, even though the thickness of the floating gate oxide layer is not reduced. If the thickness of the floating gate oxide is not reduced then the voltage on the floating gate cannot be reduced. However, if the coupling ratio or coupling area between the floating gate and the control gate can be increased, the control gate voltage can be reduced consistent with the requirements of the process shrink. Use of dual control gates coupled to opposing sidewalls of individual floating gates along with increased thickness of the floating gate provides this increased coupling area.

Second NAND Array Embodiment

A modification of the memory cell array of FIGS. 3-5 is shown in FIGS. 6-10, which are cross-sectional views along a NAND string in the y-direction after sequential processing steps are performed. FIGS. 4 and 10, of the first and second embodiments at comparable stages of their formation, show that the number of memory cell floating gates included in the same length of the NAND string is much higher in FIG. 10 than in FIG. 4, almost twice as many. The structures appear in the x-direction to be the same. The structure of this second embodiment has the same features and advantages described above for the first embodiment, plus a significantly smaller memory cell size in the y-direction. This is accomplished by a novel combination of undercutting and use of spacers to form elements smaller than the smallest lithographically resolvable element size of the process being used.

FIG. 6 shows a cross section B-B along the x-direction of the array of FIG. 3 after a first series of processing steps to form the vertical strips of polysilicon P1 (later to become the floating gates) separated by the STI field oxide according to the second embodiment. The initial steps in forming the intermediate structure of FIG. 6 are the same as described above for the first embodiment as shown in FIG. 5A at a comparable stage of the process. A substrate 111 is appropriately doped to contain one or more wells and a layer 115 of tunnel oxide is grown over a surface 113 of the substrate. A layer of doped polysilicon is then deposited over the oxide, an oxide pad formed on its top, a nitride layer formed over that and the polysilicon/dielectric layers then etched into strips extending in the y-direction. The STI trenches are then formed between the polysilicon strips and filled with oxide. The excess oxide is removed by CMP down to the nitride layers used as a stop. One difference with the first embodiment is that the nitride layer corresponding to 95 of FIG. 5A has been removed from the oxide pad 119, for example using a wet etch.

Next, a relatively thick (50-200 nm.) dielectric layer 121, such as densified silicon dioxide, is then deposited over the oxide pad 119 as shown in FIG. 7. A photoresist mask 123 is then formed over this dielectric layer with strips extending in the x-direction, and having widths and spacing in the y-direction determined by the lithographically minimum resolvable element size. The dielectric layers 121 and 119 are then etched through this mask. The width of the resulting strips can be made smaller than the width of the mask strips by undercutting or over-etching sideways. Resulting relatively thick dielectric strips 121 extending in the x-direction across the polysilicon strips and isolation oxide between them is narrower than the mask strips 123 through which they are formed. The oxide pad 119 is also removed as a result of this etching step. This etching step is controlled in order not to remove excessive amounts of isolation oxide between the polysilicon strips (regions 97-100 in FIG. 6).

A next series of steps are illustrated by FIG. 8. After the mask 123 is removed, a thin (approximately 5 nm. thick) oxide pad 125 is reformed on the surface of the polysilicon strips. This is followed by depositing silicon nitride over the array, typically using an LPCVD process, and then anisotropically etching the nitride to leave spacers 127 along the walls on both sides of the oxide strips 121. The thickness of the deposited nitride primarily determines a length L of the spacer, which in turn (as described later) determines the length of the floating gates, which is significantly less than the minimum width of the process being used to form the structure. A width W of the undercut oxide strips and the length L of the spacers (FIG. 8) are preferably chosen to result in substantially equal spacing of the spacers 127 along the lengths of the polysilicon strips 117, since (as described later) this determines the spacing of the resulting floating gates in the y-direction. It will also be noted that the materials for the strips 121 and spacers 127 may be exchanged, the strips 121 being a nitride and the spacers 127 being an oxide, as the importance of the materials used is to allow removal by etching of the strips 121 while leaving the spacers 127 intact.

This removal and other steps are illustrated by FIGS. 8 and 9. The gaps between the nitride spacers 127 (FIG. 8) are first filled with oxide so that etching away the oxide strips 121 does not result in over etching the field isolation oxide that is exposed between the NAND strings. CMP then removes any excess oxide, down to tops of the nitride spacers 127 used as CMP stops. This oxide between the spacers 127 and the oxide strips 121 are then anisotropically etched together back to the top surface of the polysilicon layer 117, which may be used as end point detection to terminate this oxide etch. Alternatively, to protect the exposed isolation oxide between the memory cell strings, this isolation oxide could be masked with a material that is not etched as the oxide strips 121 are removed, and this masking material then removed after the oxide strips 121 have been removed.

A next step is to use the remaining nitride spacers 127 as a mask to separate the polysilicon strips, such as the strip 117, into islands of isolated floating gates. Anisotropically etching the polysilicon leaves floating gates 131-138. The source and drain ion implantation then takes place, using the floating gates and covering nitride spacers as a mask. The N+ ion implant dose can be within a range of from 5E13 to 1E15. Implanted regions 141-147 between the floating gates are the result. It should be noted that even though floating gate structures 131-138 may be tall and extremely thin, they are nonetheless mechanically stable by virtue of support from adjoining walls of the isolation oxide.

Referring to FIG. 10, a next step is the formation of a dielectric layer 151 that conforms to the outside surface of the memory array, as it exists in the stage illustrated in FIG. 9. The dielectric 151 is preferably made of ONO to a thickness of between 100 and 200 nm. Next, a second layer of doped polysilicon is deposited by LPCVD over the array to completely fill the gaps between floating gates in contact with the dielectric layer 151. Excess polysilicon material is then removed by CMP back to the nitride layer material in the ONO layer 151, or, if ONO is not used, to the tops of the nitride spacers 127 that remain as part of the structure. An additional polysilicon etching step is desirable in order to remove any stringers that may remain across the nitride spacers 127. The result is separate control gate lines 153-159. In order to increase their conductivity, they may be formed and treated using any of the variations as described in the first embodiment. The exposed surface of the structure is then covered by a passivation dielectric layer, following by forming metal conductive lines and vias to connect the lines with source and drain regions at the end of the memory cell strings, and the control gate lines along their lengths.

It can be observed from FIG. 10 that the structure of the second embodiment has all the advantages described above for the first embodiment, plus a higher density of floating gates along the NAND strings. This added advantage results from making the length L of the floating gates and space W between them smaller than the minimum definable lithographic feature size.

Other Features

With reference to FIG. 11, an additional advantage in the operation of an array according to either of the first and second embodiments is illustrated. The typical NAND string, as it is further scaled down, begins to suffer more severely from edge trapping of electrons in the oxide at the side edges of the floating gate, as indicated at 161 and 163. After extended cycling (programming and erasing), some tunneled electrons remain trapped in thicker portions of the oxide immediately adjoining the tunnel oxide over the channel region. This trapped charge contributes to the conduction state of the memory cell transistor; the more trapped electrons, the higher the threshold voltage during read. However, if, subsequent to programming the device is stored at a relatively high temperature (e.g. 125° C.), this oxide trapped charge may be ejected back into the substrate. This is called “relaxation”, and can result in a threshold voltage that is 0.3v-0.7v lower than the threshold voltage immediately after programming. This relaxation can be a significant problem, particularly when operating at more that two storage states per floating gate (“multi-state” or “MLC”) operation. It can result in data loss in all cells that have been previously heavily programmed.

This relaxation effect is partially or entirely eliminated in either of the embodiments described above by the presence of the control gate lines (CG1 and CG2) in close proximity to the edges of tunnel dielectric at the edges of the floating gate (FG), and the high voltages applied to these control gates during programming. This results in trapping of electrons outside the channel region at trapping sites that are much deeper into the oxide insulator, and therefore are far less susceptible to relaxation after storage at high temperatures.

FIG. 12 illustrates a modification that may be made to either of the embodiments described above, in a cross-sectional view taken along a NAND memory cell string. The process flow may be modified to introduce shallow cavities or trenches in the active silicon between adjacent floating gate transistors in the NAND series string. Two such trenches 165 and 167 are shown in FIG. 12. The trenches are formed by etching into the substrate to a depth of between 20 nm to 50 nm, and is performed after the floating gates have been formed and the exposed tunnel dielectric between them has been removed. Prior to deposition of the second polysilicon layer from which the control gate lines are formed, the silicon of these shallow trenches is implanted with phosphorus or arsenic, typically to a dose of between 5E13 and 1E15 at a low energy, to form source and drain regions 169 and 171.

Alternatively, a p-type doping of the memory cell channel regions of the substrate, which typically takes place at an initial stage of the processing, can be made sufficiently low that the silicon surface in these trenches is inverted when the overlying control gate is held to a slightly positive voltage (VCG>0.5V). In this alternative embodiment of field induced inversion in the source and drain regions between adjacent transistors in the NAND string, the control gate voltages are set at a sufficiently positive voltage to induce an inversion layer along the surface of the trenches and therefore permit conductivity between adjacent floating gate transistors along the NAND string. In this alternative embodiment, the N⁺ implant into the silicon source and drain regions along the NAND string is either at a very low dose, perhaps between 1E13 and 5E13, or is altogether omitted. Use of a field induced inversion layer to facilitate electronic conduction thru the entire series NAND string outside of the floating gate transistors can further improve the programming and erasing cycle endurance, because even a low dose of N⁺ implant (which is currently necessary but is hereby avoided) can cause damage to the tunnel dielectric at the edges of the floating gate, and may therefore be preferentially avoided. In either case, whether or not the silicon in this trench is implanted N⁺ or not, the boosting capacitance between the control gate lines and the substrate is increased substantially by virtue of this very shallow trench, even if the lateral spacing W between adjacent floating gates is very small.

Operation of the NAND Array Embodiments

The fundamental element of the new NAND cell structure of both embodiments described above is the formation of two, rather than one, control gates, for each floating gate, rather than stacking the control gate over the floating gate as is traditional. A schematic representation of this is given in FIG. 13 to show the coupling between the gates. Capacitive coupling C_(CF1) and C_(CF2) exists between opposing sidewalls of a floating gate FG and respective adjacent control gates CG1 and CG2 on opposite sides of the floating gate. This coupling is through the ONO or other interpoly dielectric (not shown) that is positioned between these gates. Also, capacitive coupling C_(FS) between the floating gate FG and the substrate through the tunnel dielectric (not shown). None of the control gates necessarily couples to the floating gates from their top surfaces, as is customary in conventional structures. Thus most of the coupling between the two control gates and the floating gates of each transistor is along the vertical walls that they share.

The capacitive coupling ratio of the floating gate transistor in the new configuration can be improved greatly from an increased physical height of the floating gate and an opposing control gate. With reference to FIG. 13, the coupling ratio is approximately: $\begin{matrix} {\gamma \approx \frac{C_{{CF}\quad 1} + C_{{CF}\quad 2}}{C_{{CF}\quad 1} + C_{{CF}\quad 2} + C_{FS}}} & (1) \end{matrix}$

Typically, the tunnel dielectric of capacitor C_(FS) includes an SiO₂ film of thickness between 7 and 9 nanometers, while the dielectric of capacitors C_(CF1) and C_(CF2) is typically a sandwich ONO dielectric with an oxide equivalent electrical thickness of between 14 and 18 nanometers. Therefore, if the area of capacitive coupling along each of the two vertical walls of the floating gate is twice the area of channel coupling, then the coupling ratio equals approximately 0.66, which is quite adequate for proper device operation. If a higher value is desired, so that maximum program and erase voltages can be further decreased, this can be readily achieved by forming all floating gates with a greater thickness. This increases the coupling area with adjacent control gates, without increasing the coupling area of the floating gates with the substrate. The new structure provides a path to scaling down minimum floating gate transistor feature size without reducing the coupling ratio γ, and without the need to maintain very high program and erase voltages in highly scaled NAND devices.

Since the dual control gates are in close physical proximity to the substrate, a capacitive coupling C_(CS1) and C_(CS2) between each of the respective control gates CG1 and CG2 and the underlying source and drain N⁺ diffusions is significantly enhanced relative to the standard NAND that has the control gate on top of the floating gate. In effect these dual control gates also serve the function of booster plates that have been suggested by others to be included in addition to the floating and control gates. The control gates of the NAND structures described herein have the same beneficial effect on channel boosting during the program inhibit mode, yet they do so without the need for a separate booster plate with its attendant problems.

The basic operating principles of the dual gate NAND embodiments described above for erasing, programming, program inhibit, and reading are quite similar to the standard NAND structure, except that the specific control gate (word) line voltages need to be applied to the two control gates straddling the selected row of NAND transistors, one from either side. Furthermore, because each of the selected control gates is also capacitively coupled to the floating gate of the NAND transistor floating gate on its other side, capacitive coupling with appropriate voltages on adjacent word lines has to be employed to prevent program disturb conditions or read-inhibit conditions.

A set of exemplary voltages that perform these operations in the NAND embodiments described above is given in the table of FIG. 15. As an example, consider that the row of floating gates 28, 31, 34, 37 and 40 (FIGS. 3 and 14) is being accessed for programming. A single floating gate capacitively coupled with two control gates results in an equivalent capacitor divider circuit. Assuming for the purpose of illustration that each of the three capacitances of each of the floating gates with the control gate 82, the control gate 83 and the substrate (C_(CF1), C_(CF2) and C_(FS) in FIG. 13) are equal. If 20 volts (V_(CG1) and V_(CG2)) are applied to each of the control gates lines 82 and 83 and 0 volts to the substrate, then the voltage of each of the floating gates in the row will be the sum of these three voltages (40 volts) divided by 3, or 13.3 volts Therefore, there is a voltage drop of 13.3 volts across the tunnel dielectric layer separating the floating gate from the substrate channel region. This creates an extremely high electric field that causes electrons to tunnel from the substrate through the gate dielectric and onto the floating gate (Fowler-Nordheim tunneling). Note that in this discussion we are not including the voltage contribution coming from net negative or positive charge on any floating gate from a previous erase or programming operation.

Programming voltages are typically applied in pulse sequences, with typical pulse duration of several microseconds. At the same time that the row of floating gates 28, 31, 34, 37 and 40 is being programmed, the unselected rows of floating gates on either side of this row should not be allowed to be affected. Floating gates 27, 30, 33, 36 and 39 are in one of these adjacent rows and floating gates 29, 32, 35, 38 and 41 in the other (FIGS. 3 and 14). However, one side of each of these floating gates is capacitively coupled to one of the control gates 82 and 83 that are at 20 volts, in this example. But the opposite side of each of these floating gates is at the same time capacitively coupled with either of the control gates 81 or 84. If the voltages on these control gates are set to 2 volts and the substrate is 0 volts, the floating gate voltages in these unselected rows will be about 7.3 volts. This voltage across the floating gate oxide will be insufficient to cause electrons to tunnel through the oxide from the substrate channel during the programming pulses.

It will be noted from the table of FIG. 15 that the voltages applied to control gates not along the selected row of control gates are set to different voltages, depending upon whether the row is below or above that being programmed or read. This assumes a type of NAND in which the rows are programmed sequentially in order starting from the side of the array connected to VS. Thus, in the example of FIGS. 3 and 14, the earlier rows of floating gates below the selected are known to have already been programmed. Similarly, in a programming operation, it is also known that the later rows above the selected row are in the erased state. For proper programming, it is required that the bit line voltage (0V) be applied at the channel of the floating gate transistor being programmed. This in turn requires that all series transistors in the NAND chain that are between the cell being programmed and the bit line, be turned on during this programming. This requires the corresponding control gate voltages to be above 0V, typically 1V to 2V. Further, although this discussion references the array of FIGS. 3 and 14, which are more specifically associated with the first embodiment described above than the second, an array according to the second embodiment is operated in the same way.

For proper read sensing to occur, all of the unselected transistors in the NAND should be conducting, i.e. in their “on” state, to allow proper interrogation of the one selected memory cell transistor in each string that is in the selected row. Assuming it requires a minimum of 3.3 volt on the floating gate to ensure conduction in a memory transistor programmed to the highest threshold state, and that capacitances between floating gate to substrate and floating gate to adjacent control gate are all equal, then the sum of the two adjacent control gate voltages should be a minimum of 10 volt. FIG. 16 shows one NAND string consisting of 8 transistors (T0-T7) and 9 word lines (WL0-WL8) for simplicity, but it is assumed that the actual array consists of multiple parallel NAND strings, each with 16, 32 or more transistors as described previously in regard to FIGS. 3 and 14. Assuming multi-state transistor T4 is selected for reading and that the desired reading mechanism is successive increase of the floating gate voltage until bit line conduction is observed, the voltage on the floating gate should be increased sequentially from a low value to the high value (3.3 volt) in nearly as many steps as there are states in the cell. For example, if four states are stored in the cell, at least three voltage steps are required to differentiate between the four states.

There are a variety of ways to satisfy this condition. One possible approach is to place V_(R0) volt on both of the word lines (WL4 and WL5) immediately adjacent to the selected transistor (T4), 10−V_(R0) volt on the next adjacent word lines (WL3 and WL6) both above and below the selected cell, and continue this alternating pattern of V_(R0) volt and 10−V_(R0) volt on all the remaining word lines working outward both above and below the selected transistor until voltages are applied to all word lines. V_(R0) is chosen as the control gate voltage that when applied to both of the adjacent control gates will distinguish the lowest threshold state (erase) from the lowest programmed charge storage state (“1”). Typical values would be between 0 and 1 volt. Then the bit line current is sensed to determine presence or absence of conduction. These voltage conditions result in all unselected transistors having a voltage of 10 volt on the sum of their adjacent control gates resulting in a floating gate voltage of 3.3 volt which is above the highest possible floating gate state and will guarantee conduction of all unselected transistors. To read the next state of the selected cell all word lines at V_(R0) volt are set to a new voltage, V_(R1), and all word lines at 10−V_(R0) volt are set to a new voltage 10−V_(R1) and the absence or presence of bit line current is sensed. In a similar fashion to V_(R0), V_(R1) is chosen to distinguish between the lowest programmed state (“1”) and the next highest programmed state (“2”). This process is continued until all possible programmed states are sensed. This approach maintains a constant and minimum necessary voltage on each floating gate and tends to minimize the possibility of a read disturb condition to the charge state of all floating gates.

An alternate approach to read the selected floating gate state is to place VR0 volt on both of the word lines (WL4 and WL5) immediately adjacent to the selected transistor (T4), 10−V_(R0) volt on the next adjacent word lines (WL3 and WL6) both above and below the selected cell, and 5 volts on all remaining word lines. As the voltage on the selected word lines is raised, the voltage on the two adjacent word lines can be lowered by the same amount. This approach has the advantage that a maximum of four control gates are being switched but has the disadvantage that the transistors adjacent to the selected transistor are continually stressed more than necessary because their floating gate voltage is held at 5 volts rather than 3.3 volts as in the previous approach.

Erase by block is performed the same way as prior art NAND blocks. All control gates in a block are either at 0V (erased block) or floating (non-erased block) while the local substrate (p-well and underlying n-well) for the entire array is raised to ˜20V.

It will be understood that the voltages shown in the table of FIG. 15 are provided by way of an example only, and other voltages may work equally well or even better. For example, it may be preferable to sequence the voltages applied to the dual control gates addressing a certain floating gate, so as to avoid spiking and excessively high voltages. Furthermore, it may be advantageous to set the specific voltage on any control gate in the addressed NAND string to a certain voltage level and then let it float at that voltage level during the subsequent read, write or erase operation, relying on the capacitive coupling that exists between every control gate word line and it's adjacent structures to dynamically maintain the floated voltage on said control gate. This concept may be employed to use global word lines to access and selectively set the voltages on more than one local control gate (word) lines. Furthermore, as the thicknesses of the various dielectric layers adjacent to each floating gate are scaled down in future generations, all voltages should be correspondingly scaled down to avoid excessively high electric fields with their attendant possibility of shorts and destructive dielectric breakdown.

Alternate Fabrication Methods for Either Array Embodiment

In at least some of the methods described earlier to fabricate various array embodiments, a set of elongated vertical strips of floating gate material are first defined forming strips and used as a mask to form the isolating trenches separating these strips, thus forming the active regions that will later become the NAND strings. This is then followed by a masking operation forming horizontal strips that are used to etch these vertical strips of floating gate material, thereby forming a two-dimensional array of individual floating gates. Without an additional masking step, horizontal wordlines intrinsically forming control gates are formed in the resulting spaces between the rows of individual floating gates.

In this embodiment, a fundamentally different approach is followed. In overview and summarized later in FIG. 21, elongated strips of floating gate material are formed in the horizontal direction using a first mask and strips of control gate material are formed between these floating gate strips but insulated from them, preferably without the use of an additional mask. Next, in the same process step, both the floating gate and control gate strips are isolated in the vertical direction using a second mask to form a two dimensional array of isolated floating gates and control gates. This second mask defines the active regions that will later become the NAND strings and the isolation regions therebetween. Finally, an additional layer of conductive material is deposited and using a third mask, the isolated control gates are interconnected forming word lines running generally in the horizontal direction. Details of several embodiments following this overall approach are described in the following sections. In some of these embodiments spacers are employed to accurately form the elongated floating gate strips to a narrow dimension that is smaller than the minimum lithographic dimension.

Alternate Embodiment 1 Use of Spacers To Define The Floating Gate Channel Length

This embodiment, like the Second NAND Array Embodiment, uses spacers to define the channel length of the floating gates. FIG. 17A is a plan view showing a set of photoresist strips of width W′ and pitch P running horizontally in the X direction. FIG. 17B is a cross section through section A-A of FIG. 17A and shows a collection of layers underlying the photoresist strips 1711. Referring to FIG. 17B, a substrate 1700 is appropriately doped to contain one or more wells and a layer of tunnel dielectric 1702 is grown or formed by deposition over a surface 1701 of the substrate, typically to a thickness in the range of 5 nm to 10 nm. A layer of polysilicon 1705 having a thickness in the range of 30 to 80 nm is then deposited over dielectric 1702, an oxide pad 1708 is thermally grown or deposited on its top surface, and a nitride layer 1709 is deposited over the oxide pad forming a composite dielectric layer. The polysilicon 1705 is typically doped during deposition and will later be patterned to form the individual floating gates. The oxide pad 1708 may be a low temperature deposited oxide such as TEOS (Tetraethyl Orthosilicate), and its thickness may be in the range of 30 to 60 nm. The nitride layer 1709 may be in the range of 60 to 100 nm. The formation of spacers used to etch horizontal strips of floating gate material is very similar to that described earlier in the Second NAND Array Embodiment, and is repeated here in outline form for the convenience of the reader, although the choice of the specific dielectric materials used to form the spacers has been changed as suggested in that description. It should be clear to a person skilled in the art that the actual materials used for the formation of the spacers need not be dielectric materials. For example, polysilicon material or other deposited layers can be suitably used to define the spacers. Dielectric 1702 may be a layer of silicon dioxide or a sandwich structure including of one or more thin dielectrics such as silicon nitride, aluminum oxide, hafnium oxide, hafnium silicon oxide, or other wide bandgap or high K dielectrics.

A photoresist mask 1711 is formed over this composite dielectric layer defining a first set of strips 1711 extending in the x-direction through at least major portions of the entire array area, and having width W′ and pitch P in the y-direction determined by the lithographically minimum resolvable element size (refer to plan view FIG. 17A). At least the top layer of the composite dielectric is then etched through this mask. The width of the resulting strips W can be made smaller than the width of the mask strips W′ by undercutting or over-etching sideways. This may be desirable to arrive at a set of parallel floating gate strips of width W with approximately equal spacings between them while conforming to the photolithographic limitations of the equipment used to define and etch these first set of strips.

A next series of steps are illustrated by FIG. 17C. After the photoresist mask 1711 is removed, the spacer material is deposited over the array, typically using an LPCVD process, and is then anisotropically etched to leave spacers 1715 along the walls on both sides of the first set of strips 1709. In one embodiment, the spacer material is silicon oxide and its deposited thickness primarily determines the length L of the spacer, which as described later determines the channel length of the transistor channels to be formed under the floating gates. L can be significantly less than the minimum photolithographic width of the process being used to form the structure W′. Furthermore the use of a spacer to define L, as opposed to the use of a photolithographic step, results in much tighter control of the dimension L when the exposure tool is pushed to its lithographic limits. A width W of the undercut nitride strips and the length L of the spacers are preferably but not necessarily chosen to result in substantially equal spacing of the spacer strips 1715, since this determines the spacing of the resulting floating gates in the y-direction as described later. In one embodiment where the lithographic pitch is approximately 120 nm, L may be in the range of 15 to 50 nm.

This removal and other steps are illustrated by FIGS. 17C, 17D, and 17E. Reactive ion etching may be used to form the spacers, removing excess spacer material above and in regions between the nitride strips 1709. The nitride is then removed by chemical etching exposing the oxide layer 1708 everywhere except under the spacers 1715. Finally, the oxide 1708 and polysilicon 1705 are etched using the spacers as a mask, preferably stopping on the underlying tunnel dielectric layer 1702, forming a composite stack 1719. If spacer 1715 is an oxide layer, then its minimum thickness must be chosen such as to preserve a sufficient remaining thickness after etching through oxide layer 1708, so that the remaining spacer can withstand the subsequent etch of polysilicon 1705. The polysilicon etch is preferably chosen to etch the polysilicon at a much faster rate than the spacer material. In other embodiments it may be desirable to remove the tunnel dielectric layer 1702 in the region between the stacks 1719 and re-grow or reform a new dielectric layer. Layers 1708 and 1755 may optionally be removed.

The next series of steps shown in FIGS. 17F and G forms parallel sets of control gate material in the slots between the composite strips 1719 containing the floating gate strips. An insulating layer 1725 forming the inter-poly dielectric (IPD) is deposited over the composite stack. This layer is preferably a composite layer formed of a thermally grown and/or deposited oxide followed by deposited nitride followed by a second layer of deposited oxide (ONO), although other IPD materials including the dielectrics cited earlier with respect to layer 1702 either singularly or in combination are also possible. Portions of this layer or the layer in its entirety may be removed from the top surface of the composite stack, but preferably remains at least on the sidewalls. In one embodiment, a doping material 1730 is implanted into the substrate 1700 in the regions between the floating gate strips. This doping material is of opposite conductivity type from that at the surface of the substrate 1701 and typically several orders of magnitude higher in concentration. This step forms source and drain regions ohmically connecting the channels of the floating gate transistors and providing serial connectivity for the NAND string. In other embodiments the concentration of this doping may be drastically reduced or the step eliminated so that conductivity between floating gates is influenced or controlled by the control gate as explained earlier in connection with FIG. 13.

Next, a layer of polysilicon 1735M is deposited, typically doped during deposition, filling the exposed slots and covering the composite strips. Other materials, especially high temperature metals such as Tungsten, Tantalum, Molybdenum singly or in combination with their silicides, may be substituted for polysilicon. Portions of this material will eventually serve as the dual control gates straddling each floating gate in the final device. Some of the considerations involved in selecting such a material include overall compatibility with silicon processing and deposition conditions, heat treatments, and anneal environments used later in the process. Additional considerations include the ability to conform and fill very narrow spaces, the use of metals with high workfunction, and the use of low resistivity materials, especially the ability to minimize depletion or voltage drop within the material under high field conditions. When material 1735M is polysilicon it may be capped with a barrier metal such as TiN or TaN, or by selective silicidation, to ensure good ohmic contacting to the ensuing wordline material, as described below.

In another embodiment the control gate strips 1735 can be recessed into the silicon substrate as described earlier (see FIG. 12). Prior to depositing insulating layer 1725 the substrate 1700 is etched to a depth typically between 20 to 50 nm, and a thin thermal oxide is grown to passivate the substrate and the exposed edges of the floating gate strips. Then layer 1725 is deposited, source-drain formation optionally occurs (in one embodiment by ion implantation), followed by deposition of the control gate material 1735M. This structure increases the effective channel lengths of the transistors in the NAND string by the extent of the vertical walls of the recesses formed in the substrate.

The polysilicon or conductive material 1735M over the floating gate strips may be removed using standard etch techniques, reactive ion etching, or CMP, preferably without the use of an additional masking step. This type of process often referred to as a damascene process is well known to those skilled in the art, and described in standard reference texts such as “Silicon Processing for the VLSI Era, Volume 4” by Stanley Wolf, published by Lattice Press. The result is that deposited layer 1735M is formed into a set of parallel control gate strips 1735, and the array area contains parallel sets of floating gate strips separated by sets of control gate strips, both sets of strips running horizontally. In FIG. 17F the control gate lines are shown as being wider than the floating gate lines, but this for ease of illustration only and in some embodiments the floating gate lines are wider than the control gate lines. Control gate strips 1735 are shown in FIG. 17I to be essentially rectangular in cross section for ease of drawing, but this is highly idealized in practice where such perfect contours are seldom obtained. In practice they may partially overlap the top of stack 1719, but the essential feature is that adjacent strips 1735 be isolated from each other at some region over the top surface of stack 1719.

The next step in the process is to etch through the parallel floating gate and control gate strips and etch into the silicon substrate thus defining the active areas containing the NAND strings (see FIG. 17H through FIG. 17M). A photoresist layer (possibly formed over additional deposited layers) is applied and masked to form vertical strips 1741, as shown in FIG. 17H, a plan view of the relevant memory area. FIG. 17I shows a cross section of the structure along section A-A of FIG. 17H with the photoresist 1741 visible over the floating gate stacks 1719 and the control gate strips 1735. Next, using the photoresist as an etch mask, the parallel strip structure is etched down to the substrate surface. This is a compound process as various layers need to be removed, requiring different etching materials. For example, an oxide/nitride etch is performed to cut through layers 1715 and 1708 (FIG. 17E) over the floating gate strips if present, and layer 1725 thereby exposing the floating gate material. Any insulator over the control gate material is also removed, and the polysilicon control gate and polysilicon floating gate are etched, stopping at the underlying tunnel dielectric 1702 or the gate insulator under the control gate. Alternately the floating gate and control gate may be etched in separate steps. The etch chemistry is changed and these layers are removed in regions not originally covered by photoresist 1741. Next the silicon substrate 1700 is etched, typically to a depth in the range of 100 to 300 nm and the photoresist removed. Finally, a thin thermal oxide in the range of 2 to 5 nm is typically grown to pacify the exposed silicon edges and an oxide is deposited, filling the trenches and also covering the regions of the floating gates and control gates previously covered by photoresist. The deposited oxide is typically densified by heat treatment, such as a one hour anneal in Nitrogen at 850oC. This step is followed by a planarizing step, for example by CMP, reactive ion etching, or other suitable techniques to remove the excess deposited oxide over the active areas leaving a flat surface with a filled oxide region 1745 as shown in FIG. 17L and FIG. 17M, which are cross sections through cut lines B-B and C-C of FIG. 17K respectively. The sequence of steps involved in etching through the parallel strips and into the substrate followed by filling the resulting trench with a deposited insulator and removing it from over the active regions is referenced later in this description by the acronym STI (shallow trench isolation). In some embodiments of STI the end result of the planarization step may result in the deposited oxide not totally filling the trench but being partially removed by overetching or other means.

At this point the structure is nearly completed except the control gates 1735 are discontinuous and must be interconnected to form wordlines used to apply a common control voltage to all control gates connected to each wordline. This is accomplished as shown in plan view in FIG. 17N, and FIG. 17P, a cross section through cut line A-A of FIG. 17N. The exposed top surfaces of the isolated control gates must establish a good ohmic contact with the connecting material 1755 that will form the word lines. This is accomplished for example by siliciding these top surfaces or by formation of a barrier metal such as Titanium Nitride or Tungsten Nitride. The connecting material 1755 that connects the isolated control gates is desirably a low resistance material and patterned as wide as possible. Preferably this material is a high melting point metal containing excess silicon, forming a silicide such as Tungsten silicide (WSix), Cobalt silicide or Nickel silicide, though many other combinations are possible. In principle the material is deposited, annealed to make ohmic contact with the control gate segments 1735′, and etched to isolate the parallel lines. However, in this case the patterning may preferably be accomplished using spacer technology since in this example the wordline pitch is less than the photolithographic limit.

One example of how this patterning can be accomplished is to deposit a sheet of Tungsten silicide (WSix) to a thickness of approximately 150 nm followed by a composite capping layer of 20 nm polysilicon followed by 60 nm of silicon nitride. The silicon nitride is then masked and etched leaving horizontal strips of width W at a pitch P, similar to the process described in FIG. 17A earlier. Next a spacer material is formed on the edge of the silicon nitride strips followed by etching the exposed portions of the polysilicon capping layer. Finally the exposed polysilicon silicide layer is removed leaving parallel continuous wordlines under the spacers, the wordlines in ohmic contact with the isolated control gates. There are special problems connecting to these wordlines at the periphery of the memory array because they are exiting at a sub-lithographic pitch. The reader is referred to U.S. patent application Ser. No. 11/316,654 filed Dec. 21, 2005 entitled “Flash Devices with Shared Word Lines” by Masaaki Higashitani, attorney docket number SNDK.464US1, for more details regarding forming spacer defined wordlines and contacting them in the periphery. The formation and connection of the source (SSL) and drain select gates (DSL) of the NAND string (see FIG. 14) can be made using any of the methods described earlier with respect to FIGS. 2-4.

The remaining steps in the process are relatively conventional and are well know to those working in the field of non-volatile memories. Typically an interlevel dielectric is deposited to serve as an insulator between the conductive wordlines and subsequent interconnection metal layers. Contacts must be established to each end of the NAND strings, and this may be performed by using a doping mask to limit an ion implantation of doping material (typically Phosphorus or Arsenic) to a defined contact area of the source and bit line regions of the NAND string, followed by removal of the insulation material from at least portions of these regions and subsequent deposition and patterning of a metal or low resistance interconnection material. The use of two or more layers of interconnection material with intervening insulation material and via connections through the insulation is common. Finally the completed wafer is passivated and openings formed through the passivation to allow topside connection to the bonding pad regions.

FIG. 18 shows an alternate topographical embodiment following the same process outline of FIG. 17 in which alternate columns of floating gates and control gates are slightly displaced in the vertical direction with respect to their neighbors. Referring to plan view FIG. 18A that corresponds to FIG. 17D it is seen that the floating gate strips 1805 meander though they are generally elongated in the horizontal direction. In FIG. 18B the space between strips 1805 is filled with strips of control gate material 1825 analogous to material 1725. In FIG. 18C the photoresist mask design 1841 defining the STI regions covers the jog regions of the parallel strips and after completion of the STI process steps the result is isolated floating gates 1805′ and control gates 1825′ in which corresponding gates in adjacent columns are offset with respect to their neighbors. This structure may be advantageous to minimize coupling between floating gates in adjacent columns.

Although the resulting cross-sectional shape of the floating gate described in these embodiments is relatively rectangular, included within the scope of the invention is shaping the cross-sectional area to form other types of shapes. Examples of different floating gate shapes are described in U.S. Pat. Nos. 6,894,930 and 5,343,063.

Alternate Embodiment 2 Partially Submerged Floating Gate

This embodiment is similar to the First NAND Array Embodiment in that direct photolithography rather than spacer technology is used to define the array. However, it differs from the First NAND Array Embodiment in that the floating gate is partially submerged below the original silicon surface 1701 (FIG. 17B) or 1901 (FIG. 19B). The process flow is similar to that described in Alternate Embodiment 1 (FIG. 17) except an additional sequence of steps is added at the beginning to allow the floating gate to be submerged, and the steps associated with spacers are removed. FIG. 19A shows a plan view of the completed structure corresponding to FIG. 17N, and FIG. 19B shows a cross section along section A-A of FIG. 19A.

The process begins by growing a thin sacrificial thermal oxide followed by a silicon nitride deposition over a silicon substrate 1900 containing appropriate well regions and having surface 1901. The thickness of the silicon nitride is related to the desired thickness of the ensuing floating gate, but may be of the order of several hundred nm. The silicon nitride is patterned into horizontal strips using a first mask and the sacrificial oxide exposed in these stripe openings is also removed. Then the exposed silicon substrate is etched to the desired depth, typically in the range of 20 to 100 nm. Next the tunnel dielectric 1902 is formed as described above with respect to 1702. The first polysilicon is deposited and etched back using reactive ion etching, CMP, or other means to the original silicon nitride surface. The nitride and the remaining sacrificial oxide is removed, resulting in horizontal strips of polysilicon 1905 partially submerged into the substrate surface that will later form the floating gates. A second gate oxide is grown over the exposed substrate surface 1901 followed by deposition of insulating layer 1925 as described earlier with respect to layer 1925. Optionally, as in the process of FIG. 17 but not shown in FIG. 19B, source and drain regions may be formed equivalent to regions 1730 described earlier. A second layer of polysilicon or other conductive material equivalent to layer 1735M is deposited and etched back preferably without the use of a photoresist masking step to leave isolated strips of conductive material 1935 spaced between the first set of strips 1905. The pairs of strips 1905 and 1935 are isolated using an STI process as described earlier, a field oxide is deposited and etched back to form vertical strips of isolation 1945 and isolated floating gates 1905′ and control gates 1935′. Conductive wordline material 1955 equivalent to 1755 described earlier is deposited and etched to contact the isolated control gates 1935′, followed by formation of bit line contacts, interconnection metal layers and their associated contacts and vias.

Alternate Embodiment 3 Partially Submerged Floating Gate Formed Using Spacer Technology

In another embodiment the partially submerged floating gate structure can be formed using spacer technology. The process is very similar to that described earlier with respect to FIG. 19. Referring to FIG. 20A, a sacrificial oxide 2004 is grown over surface 2001 of silicon substrate 2000 followed by a deposition of silicon nitride. The nitride is patterned and etched into horizontal strips as in Alternate Embodiment 1 using standard photolithography, shown in cross section as 2006. Oxide spacer material 2008 is then deposited and etched back to the top surface of the nitride. A second layer of nitride 2009 is deposited completing the structure shown in FIG. 20A. This structure is then etched back using the oxide spacer material and the sacrificial oxide as an etch stop, leaving not only the original regions of nitride 2006 but also nitride regions 2006 a in the area between the oxide spacers 2019 where the first layer of nitride was removed, as shown in FIG. 20B. The oxide spacers are then removed along with the underlying sacrificial oxide, and etching continues into the substrate to form the shallow trenches 2018 for the floating gates. A tunnel dielectric 2002 is grown or deposited in the trenches, a first layer of doped polysilicon deposited and planarized as in earlier embodiments resulting in strips of floating gate material 2005 shown in cross section in FIG. 20C. The remaining steps are similar to alternate embodiment 1. Nitride 2006 and the underlying sacrificial oxide are removed, a control gate oxide grown, an ONO or equivalent layer deposited over the entire structure, a second control gate material is deposited and planarized forming a parallel set of strips 2035, STI isolation is formed isolating the floating gate and control gate strips, the individual control gates interconnected into wordlines, and bit line contacts, interconnection metal layers and their associated contacts and vias are formed.

FIG. 21 is a flowchart summarizing the processes of FIGS. 17-20. In step 2101 the Floating Gate (FG) material is deposited over a substrate containing the tunnel oxide and suitable well regions. The floating gate is patterned, either using a photoresist mask or spacers defined from such a mask, forming strips generally running in the horizontal direction though periodic local offsets are included as an option. As an option, the patterning may etch shallow groves or depressions into the substrate to partially receive the floating gate material, and the floating gate material etched back to a masking surface thus defining isolated strips as described in FIG. 19 or FIG. 20. In step 2103 some form of insulation is applied to the floating gate strips to insulate them from subsequently deposited control gate material. In optional step 2105 source and drain regions may be formed between the floating gate strips. In optional step 2106 the substrate is etched to recess the control gate, creating a longer channel between adjacent floating gates. In step 2107 control gate (CG) material is deposited and defined into strips between the floating gate strips, preferably using a damascene type process as described earlier. In step 2109 the floating gate and control gate strips are isolated in the vertical direction using a photo mask, preferably by etching completely through them and into the substrate, and filling the resulting trenches with a deposited insulator as in an STI process. In step 2111 an additional conductive material is deposited and masked into wordline strips running generally in the horizontal direction and making ohmic contact to the individual control gates. Finally, in step 2113 global contacts to the top and bottom of the individual NAND strings are formed and interconnected using one or more conductive interconnect material layers.

One aspect of the device structure described in these embodiments to be noted is that as the resulting devices sizes are scaled to smaller dimensions and especially through the use of spacer technology the conductivity of the control gate becomes critical. As a high voltage is applied to this node through the wordlines the narrow control gate must couple this voltage onto the floating gate to control proper device operation, and a high coupling ratio is desirable. However, if the conductivity of the control gate is not sufficiently low, a depletion region will form in the control gate and the effective electrical “distance” between the wordline voltage and the adjacent floating gate will increase by the width of this depletion region. In the limit a narrow control gate may be completely depleted and the coupling ratio undesirably reduced. Thus the use of highly doped polysilicon to minimize the width of the depletion region and the use of highly conductive alternative materials as described earlier is desirable. In addition, forming a narrow control gate may be facilitated by the use of alternate techniques to the more convention chemical vapor deposition of polysilicon, such as atomic layer deposition. This technique is described in summary form on pages 169-177 of the earlier cited reference by Stanley Wolf, “Silicon Processing for the VLSI Era, Volume 4”, and its application to metals is described in U.S. Patent Publication 2006/0040052A1.

CONCLUSION

Although the various aspects of the present invention have been described with respect to exemplary embodiments thereof, it will be understood that the present invention is entitled to protection within the full scope of the appended claims. Furthermore, although the present invention teaches the method for implementation of the floating gate and dual control gate structure in an array of NAND strings, it will be understood that the present invention is entitled to protection when implemented in memory arrays with architectures other than NAND memory. 

1. A method of making a memory cell array on a semiconductor substrate having a surface area doped with a first conductivity type, comprising: forming a first set of strips of conductive material elongated in a first direction across a surface area of the substrate with a first layer of dielectric material therebetween and separated in a second direction thereacross with spaces therebetween, the first and second directions being substantially perpendicular to each other, forming a second set of strips of conductive material elongated in the first direction and at least partially occupying the spaces between the first set of strips in the second direction, the second set of strips being separated from the first set of strips by a second layer of dielectric material and the second set of strips being spaced apart from the substrate surface by a third layer of dielectric material, and separating the first and second sets of strips of conductive material along their lengths, thereby forming a rectangular array of individual conductive elements.
 2. The method of claim 1, wherein the conductive material of the first and second set of strips includes conductively doped polysilicon.
 3. The method of claim 1 further comprising: forming a doped region of a second conductivity type in the surface area of the substrate between said first set of strips.
 4. The method of claim 1 further comprising: forming a depression in the surface area of the substrate between said first set of strips prior to forming the second set of strips.
 5. The method of claim 1 wherein the conductive elements formed from the first strips are coupled through the first layer of dielectric to regions of the surface of the substrate thereunder in a manner that a voltage coupled to the conductive elements formed from the first strips controls a level of conduction in said regions of the surface of the substrate.
 6. The method of claim 1 wherein the conductive elements formed from the first strips are coupled through the first layer of dielectric to regions of the surface of the substrate thereunder and to conductive elements formed from the second strips through the second layer of dielectric in a manner that a voltage placed on the adjacent conductive elements controls a level of conduction in said regions of the surface of the substrate.
 7. The method of claim 1 wherein the third layer of dielectric includes the same material as said second layer of dielectric.
 8. The method of claim 1 wherein the third layer of dielectric includes the same material as said first dielectric.
 9. The method of claim 1 further comprising: forming a third set of strips of conductive material elongated in the first direction and spaced apart in the second direction, the third set of strips individually being electrically connected to a plurality of the individual conductive elements of the second conductive layer.
 10. The method of claim 9 wherein forming the third set of elongated strips includes using spacers.
 11. The method of claim 1 wherein forming the first set of strips includes: forming trenches in the substrate prior to formation of the first dielectric layer, wherein at least portions of the first set of elongated strips occupy said trenches.
 12. The method of claim 1 wherein the cross section of the first set of strips of conductive material is essentially rectangular.
 13. The method of claim 1, wherein forming the first set of strips of conductive material includes: depositing a first layer of conductive material over said first layer of dielectric material, depositing a first layer of defining material over said first conductive material and removing at least portions of said first layer of defining material into strips elongated in the first direction and spaced apart in the second direction, forming spacers along the edges of the strips of said first layer of the defining material in a manner that forms a first set of gaps between the spacers in the second direction, removing material of the defining layer of material from between the spacers, thereby forming a second set of gaps between the spacers in the second direction, and thereafter removing portions of the first layer of conductive material exposed in the first and second set of gaps between the spacers, thereby to leave the first set of strips of conductive material under the spacers.
 14. The method of claim 13 further comprising: forming in the surface of the substrate a doped region of opposite conductivity type than the first conductivity type.
 15. The method of claim 13 further comprising: subsequent to removing portions of the first conductive material, forming said second dielectric layer to cover at least portions of the sidewalls of said first conductive material.
 16. The method of claim 1, wherein forming the second set of elongated strips of conductive material includes: forming the third layer of dielectric material on the surface of the substrate between said first set of elongated strips, forming the second layer of dielectric material at least along the sidewalls of the first set of elongated strips of conductive material, depositing a layer of conductive material over the third layer of dielectric material, and defining the layer of conductive material into said second set of elongated strips such that said layer of conductive material does not completely overlay said first set of elongated strips of conductive material.
 17. The method of claim 1 wherein the conductive material of the second set of elongated strips is doped to a level that minimizes surface charge depletion at an interface between said second set of elongated strips and said second dielectric.
 18. The method of claim 1 wherein the conductive material of said second set of elongated strips is formed in a manner to minimize surface charge depletion when said second set of elongated strips have a width less than the pitch of the process.
 19. The method of claim 18 wherein the conductive material of said second set of elongated strips is formed by atomic layer deposition.
 20. The method of claim 16, wherein defining the layer of conductive material into strips includes the use of a photolithographic mask.
 21. The method of claim 16, wherein defining the layer of conductive material includes the use of reactive ion etching.
 22. The method of claim 16, wherein defining the layer of conductive material includes the use of chemical-mechanical polishing.
 23. The method of claim 16 further comprising forming the third dielectric layer to include a thermal oxide grown from the substrate surface.
 24. The method of claim 1, wherein separating the first and second sets of strips comprises: etching trenches into the substrate surface by etching through strips of the first set, strips of the second set, the first layer of dielectric, the sidewalls of the second dielectric and the third layer of dielectric, and forming a fourth dielectric material to substantially occupy the trenches between vertical strips.
 25. The method of claim 1, wherein forming the first set of elongated strips comprises: forming a fourth dielectric layer across the surface area of the substrate and a first masking layer over the fourth dielectric layer, masking and etching the first masking layer into a third set of strips elongated in a first direction and spaced apart in a second direction thereacross with spaces therebetween, forming spacers from a first spacer layer along exposed edges of the third set of strips, thereby to expose areas of the fourth dielectric layer between the spacers, the spacers being characterized by having different etching properties from the etching properties of the first masking layer, depositing a second masking layer over the exposed areas of the first spacer layer, the first masking layer and the fourth dielectric layer, the second masking layer characterized by having similar etching properties to the etching properties of the first masking layer, planarizing the second masking layer to expose the top portions of the first spacer layer, removing the first spacer layer and portions of the first dielectric layer in the exposed areas, etching the substrate in the exposed areas to form trenches, forming the first dielectric layer on exposed surfaces of the trenches, depositing a first layer of conductive material to substantially fill the trenches, and thereafter removing the first layer of conductive material except in regions previously defined by the spacers, thereby forming the first set of elongated strips.
 26. The method of claim 25 further comprising: forming a fourth set of strips of a conductive material elongated in the first direction and spaced apart in the second direction, the fourth set of strips individually being electrically connected to a plurality of the individual elements formed from the second set of strips.
 27. The method of claim 25, wherein forming the second set of elongated stripes comprises: removing the remaining portions of the first masking layer and the second masking layer, forming the second layer of dielectric material at least over the exposed portions of the first conductive material, forming a second layer of conductive material at least over the second layer of dielectric material, and defining the second layer of conductive material into the second set of elongated strips such that the second layer of conductive material does not totally overlay the first set of strips.
 28. The method of claim 1, additionally comprising: doping regions of the substrate between the individual conductive elements formed from the first set of strips along the second direction with a second conductivity type while maintaining isolation between the doped regions in the first position, thereby forming a plurality of series connected memory cell strings extending in the second direction that may be connected across operating voltages.
 29. The method of claim 28, additionally comprising: forming a third set of conductive strips elongated in the first direction and contacting the individual conductive elements formed from the second set of strips, thereby forming word lines extending across the memory cell strings.
 30. The method of claim 29, wherein the individual conductive elements formed from the first set of strips are formed in a manner to be capable of storing charge in more than two distinct levels, thereby being able to store more than one bit of data on the individual conductive elements formed from the first set of strips.
 31. A method of forming a nonvolatile memory array on a semiconductor substrate, comprising: depositing a first layer of conductive material over a first dielectric layer on the surface of the semiconductor substrate, depositing at least one defining material over the first conductive material layer, masking and etching at least a portion of the defining material into strips generally elongated in a first direction and separated in a second direction, the first and second directions being generally perpendicular to each other, forming spacers along exposed edges of the defining material and removing at least portions of the defining material exposed between the spacers, thereby exposing portions of the first conductive material layer, removing the exposed portions of the first conductive material layer thereby forming strips of the first conductive material layer elongated in the first direction and spaced apart in the second direction, depositing one or more dielectric materials at least along sidewalls of the strips of the first conductive material layer to thereby form a third dielectric layer, depositing a second layer of conductive material between the strips of the first conductive material layer with the fourth dielectric layer therebetween, removing substantially all material overlying the substrate as defined by a mask to expose strips of the substrate elongated in the second direction, thereby forming an array of floating gates of the first layer of conductive material and of control gates of the second layer of conductive material, and connecting individual ones of the control gates with a third layer of conductive material formed in strips extending generally in the first direction thereby forming wordlines.
 32. The method of claim 31 further comprising, etching the exposed strips of the substrate, thereby to form trenches elongated in the second direction, and filling the trenches with a dielectric material.
 33. The method of claim 31 wherein the semiconductor substrate surface is doped with a first doping type and further comprising forming regions in the surface of the substrate at least under the control gates of a second doping type.
 34. The method of claim 31 wherein the formation of floating gates and control gates includes connecting a common wordline to a pair of control gates adjacent to each other in the first direction but offset in the second direction with respect to each other. 